Intermetallics in Solder Joints
ثبت نشده
چکیده
Introduction Intermetallic compounds (IMCs) are generally considered a bad thing in solder joints, though this is not always the case. Excessive IMCs in solder joints are a bad thing since they significantly alter both the composition and the mechanical performance of the solder joint. Interfacial IMC layers can be an indication of the quality of the solder joint and the lack of them would indicate a solder process or possibly a material problem.
منابع مشابه
Effects of Solder Volume on Formation and Redeposition of Au-Containing Intermetallics in Ni/Au-SnAgCu-Ni(P) Solder Joints
SnAgCu is one of the most promising candidates for lead-free solders to replace conventional eutectic SnPb solders. The effects of solder volume on interfacial reactions and microstructure evolution in Ni/Au-SnAgCu-Ni(P) solder joints have been investigated under soldering and thermal aging conditions. The results show that solder volume has a strong effect on the formation of Au-containing int...
متن کاملEffects of process conditions on reliability, microstructure evolution and failure modes of SnAgCu solder joints
In this study, microstructure evolution at intermetallic interfaces in SnAgCu solder joints of an area array component was investigated at various stages of a thermal cycling test. Failure modes of solder joints were analyzed to determine the effects of process conditions on crack propagation. Lead-free printed-circuit-board (PCB) assemblies were carried out using different foot print designs o...
متن کاملEffects of solder volume on formation and redeposition of Au- containing intermetallics in Au/Ni-SnAgCu-Ni(P) solder joints
SnAgCu is one of the most promising candidates for lead-free solders to replace conventional eutectic SnPb solders. The effects of solder volume on interfacial reactions and microstructure evolution in Au/Ni-SnAgCu-Ni(P) solder joints have been investigated under soldering and thermal aging conditions. The results show that solder volume has a strong effect on the formation of Au-containing int...
متن کاملStudy of Reactive Wetting of Sn–0.7Cu and Sn–0.3Ag–0.7Cu Lead Free Solders during Solidification on Nickel Coated Al Substrates
Microstructure, wetting behavior and interfacial reactions between Sn–0.7Cu and Sn–0.3Ag–0.7Cu (SAC0307) solders solidified on Ni coated Al substrates were compared and investigated. Microstructure of Sn–0.7Cu alloy exhibited a eutectic matrix composed of primary β-Sn dendrites with a fine dispersion of Cu6Sn5 intermetallics whereas microstructure of SAC0307 alloy exhibited coarser Cu6Sn5 and f...
متن کاملIntermetallic Formation in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge Solder BGA Packages with Immersion Ag Surface Finish
Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with Ag/Cu pads are investigated. After reflow, scallop-shaped -Cu 6 Sn 5 and continuous planar -(Cu 0.9 Ni 0.1) 6 Sn 5 intermetallics appear at the interfaces of the Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder joints, respectively. In the case of the Sn3Ag0.5Cu specimens, an additional -Cu 3 Sn intermetallic layer is formed at the interface betwee...
متن کامل